ICES 675S

COM Express Basic Type 6 8/9th Gen Intel® Core™/Xeon® Processors
  • Main Feature
  • 8/9th Gen Intel® Core™ processors, socket 1151, PCH C246
  • 2-Channel DDR4 with ECC or non-ECC SO-DIMM 2666MHz up to 32GB
  • Support triple display VGA, 2 x DP, eDP/LVDS 24bit dual channel
  • PCI express lane x16 (configurable: “1 x 16” ; “2 x 8” ; “1 x 8 + 2 x 4”)
  • PCI express lane x1 (Gen 3), 8 x (can be configured x1, x 4)
  • IO: 2 x UART (RX/TX), 8 Bit DIO, WDT, TPM (optional)
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Datasheet(PDF)
CPU Support 8/9th Intel® (Coffee Lake-S) Xeon® and Core™ i7/i5/i3 processor and LGA1151 socket, TDP max 65W CPU support list
- 35W: Xeon® E-2278GEL (8C) (with ECC)
- 65W: i7-8700 (6c)/i5-8500 (6c)/i3-8100 (4c) (with ECC)
- 35W: i7-8700T (6c)/i5-8500T (6c)/i3-8100T (4c) (with ECC)
- 35W: i7-9700TE (8c)/i5-9500TE (6c)/i3-9100TE (4c) (with ECC) PCH C246
Main Memory Dual channel DDR4 SO-DIMM memory socket with non-ECC support, up to 32GB 2666MHz, ECC support as option with Intel® i3-8100, i3-8100T, i3-9100TE
Display Integrated Intel® Gen9 graphics engine 1 x VGA connector (resolution up to 1920 x 1080@60Hz) 1 x LVDS connector (resolution up to 1920 x 1080@60Hz) DDI 1/2 port configurable to HDMI 1.4/DVI/Display port 1.4 HDMI up to 4096 x 2160 @30Hz/24bpp, DVI up to 1920 x 1200@60Hz, DP up to 4096 x 2304@60Hz
BIOS AMI (UEFI)
COM Express Connector AB: LVDS: (LVDS/eDP co-lay), VGA: (VGA/DDI port3 co-lay), 1 x GbE LAN, 6 x PCIe x1, HD audio, 4 x SATA 3.0, 8 x USB 2.0, LPC Bus, SM Bus/I2C, 2 x COM, GPIO 8-bit CD: DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB 3.0
Power Requirement +12VDC, +5Vsb Support both AT and ATX power supply mode
Dimensions 125 mm x 95 mm
Environment Board level operation temperture: -0°C to 60°C Storage temperture: -20˚C to 85˚C Relative humidty
- 10% to 95% (operating, non-condensing)
- 5% to 95% (non-operating, non-condensing)
Certifications Meet CE/FCC Class B
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