ICES 673

COMe Type 6, Compact Size Module with 6th Gen. Intel® Core™ processor MCP solution, DDR4/ 5 x PCIe x 1/4 x USB3.0 / 3 x SATA3.0 and GbE
  • Main Feature
  • On-Board Intel® Core™ processor
  • 2 channel DDR4 without ECC/SO-DIMMs 2133MHz up to 32GB
  • Support three independent displays with eDP and 2 x DDI (Support HDMI/DP/DVI)
  • Support eMMC 5.0 up to 16G
  • 5 x PCIe x1, 4 x USB 3.0, 8 x USB 2.0, 3 x SATA 3.0 and GbE
  • Support Windows 10
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CPU Support Support Intel® Core™ i5-6300U processor
Main Memory Dual 204-pin SO-DIMM sockets supports up to 32 GB DDR4 2133 MHz SDRAM
BIOS AMI System BIOS Plug and play support Advanced Power Management and Advanced Configuration & Power Interface support
Display Integrated Intel® Gen.8 Graphics Engine support Triple independent display integrated GT1/GT2/GT3 to support: eDP + 2 x DDI (Support HDMI/DP/DVI)
COM Express Connector AB:
- HDA/2 x SATA 3.0/GbE/4 x PCIe x1/8 x USB 2.0/LPC bus/GPIO/SMBus (I2C)/SPI BIOS
- 2 x DDI (Support HDMI/DP/DVI)
- 4 x USB 3.0
- 5 x PCIe x1 Gen.3
Power Requirements +12VDC, +5Vsb Support both AT and ATX power supply mode One 3 pins 90 degree edge-connector for DC +12V fan
Dimensions 95mm (W) x 95mm (L)
Environment Board level operating temperatures: -10°C to 60°C Storage temperatures: -20°C to 85°C Relative humidity:
- 10% to 90% (operating, non-condensing)
- 5% to 95% (non-operating, non-condensing)
Certifications Meet CE/FCC Class B
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