ICES 670

COM Express Type 6, Basic Module with Mobile Intel® QM87 chipset 4th Generation Intel® Core™ Processors
  • Main Feature
  • Intel® 4th generation Core™ processor
  • Mobile Intel® QM87 chipset
  • Support PICMG COM.0 Rev. 2.1 Type 6 pin-outs
  • Support Dual channel ECC-DDR3L/ SO-DIMMs 1333/1600MHz up to 16GB
  • Support PCIe x16, 7x PCIe x 1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and GbE
  • Up to 3x independent displays, VGA, eDP/ LVDS, DVI, HDMI, DisplayPort
  • Dimension 95 x 125mm2 (W x L)
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The ICES 670 is a COM Express Type 6-pinouts Basic module featuring Intel® Lynx-Point PCH chipset supports Intel® 4th generation Intel® Core™ processors (Haswell/ Shark Bay mobile) with Dual ECC-DDR3 SO-DIMM socket up to 16GB DDR3L 1333/1600MHz SDRAM. The ICES 670 integrated Intel® GT1/ GT2/ GT3 graphics engines with DX11.1 support or expands via PCI Express Graphic 1x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM.0 Rev. 2.0 specification. It allows type 6-pinout Carrier board to implement HDMI, DVI, Display Port, eDP and legacy VGA, single channel 18-/ 24-bits LVDS interface. The high performance ICES 670 COM Express Basic Module supports 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and 7x PCIe x1 lanes through our NEXCOM designed ICES 8060 as well as customized solution for your embedded projects.

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